Industry Solutions

Domain-specific equipment setups tailored to your exact material and process challenges.

Core Advantages

Why Our Solutions Stand Out

We don't just build machines; we engineer competitive advantages for your production line.

Extreme Precision

Closed-loop control and micron-level tolerances ensure >99.5% yield rates even for brittle materials.

High Integration

Turnkey automation lines that combine handling, processing, and AOI inspection into a single compact footprint.

Cost Efficiency

Reduce labor dependency, minimize kerf loss, and lower your Total Cost of Ownership (TCO) by up to 30%.

Proven Reliability

Engineered for 24/7 lights-out manufacturing with dynamic balance and ultra-low friction components.

Semiconductor Materials

High-efficiency processing for SiC, GaN, and other brittle materials.

Closed-loop Tension Vision Alignment Micro-crack Prevention

The Challenge

Brittle materials like Silicon Carbide (SiC) are prone to micro-cracks and significant kerf loss during traditional slicing and processing, driving up production costs.

Our Solution

We deploy our YST-DJGX series integrated lines with closed-loop tension control and vision-guided alignment to ensure perfectly parallel cuts with zero vibration.

The Result

Yield rate improved to > 99.5%
Kerf loss reduced by 15%

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Sapphire & Premium Glass

Advanced edge-handling solutions that eliminate stress and edge chipping.

Dynamic Balance Rollers Ultra-low Friction 500m/min Rewinding

The Challenge

High-speed edge grinding of sapphire screens often results in micro-chipping and internal stress, leading to downstream failures.

Our Solution

Implementing our high-speed standalone rewinding and edge processing machines equipped with dynamic balance rollers and ultra-low friction guide wheels.

The Result

Edge chipping eliminated
Processing speed increased to 500m/min

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New Energy Automation

Unmanned factory solutions from raw material loading to final packaging.

Turnkey Transfer Units AOI Integration Robotic Handling

The Challenge

Scaling battery and solar component production requires massive labor overhead and faces severe consistency issues across multiple manual stations.

Our Solution

A fully custom turnkey automation line, integrating our core transfer units, Automated Optical Inspection (AOI), and robotic loading/unloading arms.

The Result

TCO reduced by 30%
24/7 lights-out manufacturing enabled

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Our Delivery Process

1. Concept & Review

Deep dive into your material and process requirements.

2. 1:1 Modeling

3D design and simulation of the proposed equipment.

3. Build & FAT

In-house manufacturing and Factory Acceptance Testing.

4. SAT & Ramp-up

On-site deployment, training, and production launch.

Service & Support

Service That Keeps Your Production Running. Reliable support across the project lifecycle.

Remote Support

Fast response diagnosis and troubleshooting during working hours.

On-site Service

Planned visit, commissioning and process tuning to close issues.

Training

Operator and maintenance training for safe and consistent operation.

Spare Parts

Critical spares planning to significantly reduce unplanned downtime.

Project Cases

Structured Delivery with Measurable Results. See how we deliver value to our clients.

Semiconductor

High-Yield Slicing Line

Objective: Increase SiC wafer yield and reduce kerf loss.

Result: Yield > 99.5%, kerf loss reduced by 15%.

Premium Glass

Edge Processing Automation

Objective: Eliminate micro-chipping in high-speed grinding.

Result: Zero edge chipping, speed up to 500m/min.

New Energy

Turnkey Assembly Line

Objective: Enable lights-out manufacturing and reduce labor.

Result: TCO reduced by 30%, 24/7 operation.

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